Qualcomm is investing in the 5G strong market. The company announced on Tuesday (19) the Snapdragon X55, the evolution of the first modem released by the company for the new standard of mobile connection. The new model promises to be faster, thinner and more capable to appear on handsets by the end of 2019, that is, it may well arrive for the 2020 models.
The novelty makes sense now. That’s because only about 30 devices rely on the current version of Snapdragon X50. One of the manufacturers’ complaints was that the modems were too large, especially to be allocated to devices with smaller, finer screens. Another point in favour of Qualcomm is that the X50 was created even before the final standard was effectively defined, which happened only at the beginning of last year.
What the Snapdragon X55 will look for is to bring all new systems together into one. The X50 version is currently only capable of receiving 5G signals. That is, a device already compatible with this technology must also have another chip for the other connection patterns. Only this integration, capable of receiving signals from 2G to 5G, would already make the Snapdragon X55 a much better option. Qualcomm points out that the component would be capable of “receiving any radio frequencies in any region of the world.”
In terms of speed, the company informs that it reaches up to 7 Gbps of downloads, with the current peak is 5 Gbps. In terms of upload, it runs around 3 Gbps.
Connected to 4G networks, it would also be able to offer more powerful connections, 25% more than the X24 chips used for LTE connections.
For this, the company also reported on the development of a new 5G antenna for smartphones. The third generation of them is called the QTM525, geared to fit on smartphones less than 8 mm thick. The proposal is still capable of capturing 26 GHz frequencies along with 28 GHz and 39 GHz – both of which are already available. With this scope, the company could supply to manufacturers interested in launching smartphones in the United States, Japan, Europe, South Korea and Australia.
In the same announcement, Qualcomm also presented other components. The first of these is the QET6100 5G Envelope Tracker, aimed at giving more efficiency in the use of frequencies of 100 MHz. As a result, it increases the speed and decreases the use of a battery.
Another component is the QAT3555, designed to allow the use of frequencies between 600 MHz and 6 GHz, allowing more efficient and reducing the information package by 25%. According to Qualcomm, the X55 will be the first chip to have these components, being also the first to have both features.
The company will offer this new piece not only for smartphones but also for routers, laptops, car applications and the connected home.
The new modem will be officially presented at the Mobile World Congress, an event that begins on February 25 in Barcelona, Spain.