The Chinese smartphone manufacturer has been using its chipsets in its own equipment and also in the Honor sub-brand. The advantages are many, including lower costs and less reliance on third parties.
At the moment there is still no technical information related to this new chipset. However, mass production should start when the first 5G network is launched.
The HiSilicon Kirin 970 is Huawei’s latest high-end mobile chipset, which was the first to integrate artificial intelligence. It is an 8-core processor that provides a clock speed up to 2.4 GHz, ie 4 x Cortex A73 at 2.4 GHz + 4 x Cortex 53 at 1.8 GHz. It has a 12-core Mali G72MP12 graphics card which guarantees a 20% increase in performance over the previous generation, as well as a 50% increase in efficiency.
However, the performance of Kirin 970 is not up to the Snapdragon 845 from Qualcomm, which is currently dominating the mobile device market. That said, the upcoming Kirin 980 chipset from HiSilicon is expected to outperform Qualcomm’s chipset as it will use TSMC’s 7nm manufacturing process.
Qualcomm has dominated the mobile chipset market and has little or no competition in the high-tech market. However, this may change soon, as companies like Huawei and Samsung are working to create very powerful chips, albeit with different strategies.
Samsung has been in talks with several Chinese manufacturers, including ZTE, to supply its own Exynos chipsets. Huawei does not want to position chipset production as an independent business and as such does not intend to sell to third parties.